The Department of Defense (DoD) is driving a clear and urgent push to integrate modern artificial intelligence (AI) capabilities into rugged edge applications. However, bridging the gap between AI’s rapid advancements in data centers and its deployment in the field presents significant challenges. From navigating standards that meet the Modular Open Systems Approach (MOSA) to ensuring AI workloads can perform in extreme environments, the journey from development to deployment is anything but straightforward.
Industry experts from Elma Electronic, EIZO Rugged Solutions and Concurrent introduce a solution designed to accelerate AI implementation in rugged environments. By leveraging high-performance GPUs from EIZO and Single Board Computers (SBCs) from Concurrent, this AI-Ready Development Platform enables developers to test, refine, and deploy AI applications with confidence.
Explore how a cutting-edge platform simplifies AI integration, reduces time to deployment, and ensures mission-critical AI solutions can operate where they are needed most - the tactical edge. It's a great opportunity to gain insights into the future of AI processing in rugged environments.
As new chip technologies are incorporated into cards designed to align with the SOSA™ Technical Standard and OpenVPX, physical cooling limits become more challenging and impact system design.
Uncrewed aerial systems (UASs), uncrewed ground vehicles (UGVs), uncrewed surface vessels (USVs), and uncrewed undersea vehicles (UUVs) continue to be force multipliers for U.S. military operations.