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Common Misconceptions About Signal Integrity in High-Density Backplanes: the backplane manages much of the interconnect between various circuit boards or cards across a system. By cramming more electrical connections into the same footprint, high-density backplanes seem to invite signal integrity (SI) issues, making some embedded designers skeptical about how to best move this influx of data within their applications. Here, we explore what can be accomplished using a high-density backplane, while preserving signal integrity across the network.

11 Myths About Signal Integrity in OpenVPX Backplane Design

Common Misconceptions About Signal Integrity in High-Density Backplanes: the backplane manages much of the interconnect between various circuit boards or cards across a system. By cramming more electrical connections into the same footprint, high-density backplanes seem to invite signal integrity (SI) issues, making some embedded designers skeptical about how to best move this influx of data within their applications. Here, we explore what can be accomplished using a high-density backplane, while preserving signal integrity across the network.

White paper discusses chassis management and monitoring chassis health in embedded systems deployed in military applications, using boards or plug-in cards designed to the OpenVPX standard or aligned to the SOSA standard.

Chassis Management for OpenVPX and SOSA Systems

White paper discusses chassis management and monitoring chassis health in embedded systems deployed in military applications, using boards or plug-in cards designed to the OpenVPX standard or aligned to the SOSA standard.

Whether in a lab, an industrial setting, or a mobile vehicle, instruments need to be increasingly smaller. In designing instrument cases, exact measurements are critical to maximize size, weight and performance. So how can this be done without high costs tooling, and how can costs be kept low for prototypes or low volumes?

Every millimeter counts: right-sizing for instrument cases

Whether in a lab, an industrial setting, or a mobile vehicle, instruments need to be increasingly smaller. In designing instrument cases, exact measurements are critical to maximize size, weight and performance. So how can this be done without high costs tooling, and how can costs be kept low for prototypes or low volumes?

As processors and FPGAs enable more capability, the 3U VPX form factor is being favored for its reduced size and weight. The increasingly denser performance however,brings cooling challenges to implementing systems using a 3U card. This paper examines what types of cooling options are available and how they can be implemented.

OpenVPX cooling solutions

As processors and FPGAs enable more capability, the 3U VPX form factor is being favored for its reduced size and weight. The increasingly denser performance however,brings cooling challenges to implementing systems using a 3U card. This paper examines what types of cooling options are available and how they can be implemented.

This white paper discusses supplying power for today’s highly mobile, highly rugged embedded computing environments, going well beyond just a simple power supply unit (PSU). While an integrated PSU is key to system operation, dense electronics are demanding more power than can reasonably be supplied from just one power source.

Optimizing Power Conversion in High-Reliability Rugged Embedded Systems

This white paper discusses supplying power for today’s highly mobile, highly rugged embedded computing environments, going well beyond just a simple power supply unit (PSU). While an integrated PSU is key to system operation, dense electronics are demanding more power than can reasonably be supplied from just one power source.

Mobile networking systems require solutions tailored to a range of challenging operating environments, and often with severe space limitations. These parameters can pose challenges in the design of the enclosure. This paper presents ways to address these challenges and discusses the mobile networking protocols required for seamless secure connectivity.

Packaging and functional considerations for mobile communication equipment

Mobile networking systems require solutions tailored to a range of challenging operating environments, and often with severe space limitations. These parameters can pose challenges in the design of the enclosure. This paper presents ways to address these challenges and discusses the mobile networking protocols required for seamless secure connectivity.