Significant efforts are being made to bring open standards into next-gen designs to meet the DoD’s Modular Open Standards Approach (MOSA) initiatives, most notably development of new multi-mission defense platforms using the SOSA Technical Standard. The most recent work within the standards working groups is addressing the need for a form factor "significantly smaller than 3U VPX" but still in alignment with SOSA principles of modularity, scalability, interoperability, and replaceability to address severe SWaP constraints and yet maintain scalability and interoperability that OpenVPX and SOSA provide. This rugged, modular small form factor module hardware architecture is an attractive approach for severely SWaP-constrained platform regardless of their deployment environment (air, ground, or sea).
VITA 90 offers features including more tightly defined Utility, Communications, and a new Overlay segment, provisions for blind-mate optical and coax connections, power supply module definitions, well-defined slot profiles for payload modules, switches, PNT/Radial Clock modules, and even space payloads.
This webcast will delve into VNX+, review the current status of the various VITA 90.x standards documents, as well as details of SOSA’s adoption. The speakers address the ramifications of designing ever-smaller platforms while trying to meet increasingly greater power and cooling demands of high-performance processors.
Considerations for signal integrity and aperture ramifications as well as examples of applications that can benefit are covered.
Beyond OpenVPX: Unveiling the next generation modular form factor for rugged embedded computing VITA 100
As new chip technologies are incorporated into cards designed to align with the SOSA Technical Standard and OpenVPX, physical cooling limits become more challenging and impact system design.