Over the past several years, the Modular Open RF Architecture (MORA) has evolved to address the challenges of increasingly complex radio frequency (RF) systems through an open standards-based infrastructure. With several industry partners working together to develop a collaborative framework, MORA’s interoperability and modularity has been realized, resulting in successful demonstrations of multiple manufacturers’ technologies working together. So, we asked some of our open standards partners: What’s next for MORA-based systems and the embedded computing community, now that interoperability demonstrations have been successfully deployed?
Looking back we can now see a shift in how development platforms are designed and how they are used by our integrator customer base. That shift is making it easier and less expensive to perform the development stages of a deployable system project and put solutions into the hands of the warfighter faster than ever before. Development hardware can also be shared between projects, or inherited by subsequent projects. This saves not only on lab budget, but the time to order and receive all new hardware for a new development project.
We are taking AI Computing to the next level! Find out how our membership in the NVIDIA® Partner Network complements the designs of our rugged computing systems to deliver enhanced deployable systems specifically designed to operate in harsh environments.
CompactPCI Serial hat dank seiner Modularität, Skalierbarkeit und Kosteneffizienz bemerkenswerte Erfolge in robusten Embedded-Branchen erzielt. Es handelt sich um einen modularen, offenen Standard, der hervorragende Anwendungsmöglichkeiten in Anwendungen bietet, in denen er den härtesten Umweltanforderungen standhält. Schließlich ist es in der Eisenbahn- und Transportbranche weit verbreitet. Für diesen Blog haben wir einigen Mitgliedern der CompactPCI Serial-Community folgende Frage gestellt: Welche Aspekte sollten Ingenieure bei der Bewertung von CompactPCI Serial als potenzielle Systemarchitektur kennen?
System integration challenges have changed over the past few years, with new demands being put on manufacturers for integration, troubleshooting and system upgrades. This blog explores how Elma and its partners Interface Concept, Concurrent Technologies and EIZO Rugged Solutions define what partnering means within our ecosystem when working together.
Rugged platforms for demanding applications have historically been constrained by the limited operational temperature ranges of high-performance processors and other key system components. These applications often operate in challenging temperatures, and high-performance processors aren’t generally offered with these operational temperature ranges. Until now.