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SAPHIR Plus Equipment Application Note


The SAPHIR plus ultrasonic inspection system is a modular, scalable system having a wide span of applications. It is designed for testing diverse materials, such as, steel,  aluminum, carbon fiber reinforced plastics (CFRF) and ceramics and can operate with conventional search units or phased transducer arrays.

Elma developed and manufactured Backplane and System Platform.


  • 18 layers / 6.89mm PCB thickness
  • Special shielding in P0 area for analogue signals (25MHz) routing
  • Differential ECL signals with frequencies of 1.25 GHz and 500 MHz
  • High voltage (300V) on the backplane


System Platform

  • EMC integrated system 10U 84HP 423mm deep
  • Card depth 280mm for 6U cards, 100mm rear I/O
  • Ventilation from the front bottom via the card cage to the top rear
  • AC/DC 600W power supply
  • 3 fans, temperature controlled


Why Did Elma Win?
High voltage planes and different high speed signals required a design concept for this active backplane. The challenge was to find the best compromise (to convince our customer) between number of layers, shielding of high speed signals and isolation of high voltage planes.

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