White papers provide technical insight and solutions

White Papers

• White Paper

  Why CompactPCI Serial Suits Your Application

  The CompactPCI Serial specification defines an affordable high speed serial, modular, and scalable approach to building systems for a wide range of applications, including transportation, aerospace, military, instrumentation, data acquisition, and communications. This paper describes the reasons and benefits of designing an embedded computing solution using this specification.

  white paper Why CompactPCI Serial Suits Your Application

  

• White Paper

  Chassis Management for OpenVPX and SOSA Systems

  White paper discusses chassis management and monitoring chassis health in embedded systems deployed in military applications, using boards or plug-in cards designed to the OpenVPX standard or aligned to the SOSA standard.

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• White Paper

  11 Myths About Signal Integrity in OpenVPX Backplane Design

  Common Misconceptions About Signal Integrity in High-Density Backplanes: the backplane manages much of the interconnect between various circuit boards or cards across a system. By cramming more electrical connections into the same footprint, high-density backplanes seem to invite signal integrity (SI) issues, making some embedded designers skeptical about how to best move this influx of data within their applications. Here, we explore what can be accomplished using a high-density backplane, while preserving signal integrity across the network.

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• White Paper

  OpenVPX cooling solutions

  As processors and FPGAs enable more capability, the 3U VPX form factor is being favored for its reduced size and weight. The increasingly denser performance however,brings cooling challenges to implementing systems using a 3U card. This paper examines what types of cooling options are available and how they can be implemented.

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• White Paper

  Railway communication - fast and safe with CompactPCI Serial

  Whether it’s in a lab, or an industrial setting, or even a mobile vehicle, instruments need to be increasingly smaller. In designing instrument cases, exact measurements are critical in maximizing density and performance. So how can this be achieved without high costs of tooling? How can costs be mitigated for prototypes or low volumes? This paper examines how.

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