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JetSys-5330, NVIDIA® Jetson AGX Orin™ SoM Rugged Computer with AI / IVR / AR capabilities
The JetSys-5330 enables artificial intelligence (AI) as well as intelligent virtual reality (IVR) and augmented reality (AR) applications in a rugged edge computing package. Based on the NVIDIA® Jetson AGX Orin™ system-on-module (SOM), it provides up to 2048 NVIDIA® CUDA® cores and up to 64 (64GB) Tensor Cores. The GPU can run up to 1.3 GHz on the 64GB model. This provides up to 275 TOPS and 5.3 FP32 TFLOPs of CUDA computing power. Qualified to IP67
Product Features
- NVIDIA® Jetson AGX Orin system-on-module (SoM) with Ampere architecture GPU and an array of Arm Cortex-A78AE CPUs
- Rugged design; qualified to military standards, IP67 (MIL-STD-810G, MIL-HDBK-704F, MIL-STD-1275D, and others)
- 128 CUDA cores per SM, providing up to 2048 NVIDIA® CUDA® cores and up to 64 (64GB) Tensor Cores
- Provides up to 275 TOPS and 5.3 FP32 TFLOPs of CUDA computing power
- Memory: 204 GB/s of memory bandwidth and 32GB or 64GB of DRAM
- Video Capture: Up to six GMSL2/GMSL1 cameras in x2 or x4 CSI. Up to three additional 1000BASE-T with PoE for Ethernet cameras
- Door-accessible drive bay with support for up to two removable 2.5” solid state drives
- Support for up to 3 mPCIe modules (one doubles as mSATA) and 8x GPIOs
- Wireless connectivity via WiFi or 4G/5G LTE
- High-speed Networking: 10GBASE-T
Product Information
Item/Part Number | JetSys-5330 |
---|---|
Item Description | JetSys-5330, NVIDIA® Jetson AGX Orin™ SoM Rugged Computer with AI / IVR / AR capabilities |
Extended Description | The JetSys-5330 enables artificial intelligence (AI) as well as intelligent virtual reality (IVR) and augmented reality (AR) applications in a rugged edge computing package. Based on the NVIDIA® Jetson AGX Orin™ system-on-module (SOM), it provides up to 2048 NVIDIA® CUDA® cores and up to 64 (64GB) Tensor Cores. The GPU can run up to 1.3 GHz on the 64GB model. This provides up to 275 TOPS and 5.3 FP32 TFLOPs of CUDA computing power. Qualified to IP67 |
Application | Image Processing, Artificial intelligence |
Architecture | Other |
Cooling | Conduction-Cooled |
Depth | 214.5 mm |
Elma Product Family | JetSys |
Environment | Extended Temperature, Extended shock & vibration |
Height | 112.4 mm |
RoHs | Yes |
Power (W) | 52-130 |
Weight | 6.35-7.26 Kg |
Width | 343.5 mm |