White Papers

Our white papers are designed to be educational, informative and handy.

Resources-White-Papers

White Papers

  • White Paper

    11 Myths About Signal Integrity in OpenVPX Backplane Design

    Common Misconceptions About Signal Integrity in High-Density Backplanes: the backplane manages much of the interconnect between various circuit boards or cards across a system. By cramming more electrical connections into the same footprint, high-density backplanes seem to invite signal integrity (SI) issues, making some embedded designers skeptical about how to best move this influx of data within their applications. Here, we explore what can be accomplished using a high-density backplane, while preserving signal integrity across the network.

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    Signal Integrity chart and probe test card photo
  • White Paper

    OpenVPX cooling solutions

    As processors and FPGAs enable more capability, the 3U VPX form factor is being favored for its reduced size and weight. The increasingly denser performance however,brings cooling challenges to implementing systems using a 3U card. This paper examines what types of cooling options are available and how they can be implemented.

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    Cooling methods for OpenVPX systems
  • White Paper

    Railway communication - fast and safe with CompactPCI Serial

    Whether it’s in a lab, or an industrial setting, or even a mobile vehicle, instruments need to be increasingly smaller. In designing instrument cases, exact measurements are critical in maximizing density and performance. So how can this be achieved without high costs of tooling? How can costs be mitigated for prototypes or low volumes? This paper examines how.

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    Railway communications systems based on CompactPCI Serial