bo!sys-1010 - COM Express
The bo!sys-1010 is a COM-Express-based system platform for SWaP (Size, Weight and Power)-sensitive and mobile applications.
Carrier board
- Two Mini PCIe sites for I/O expansion
- Optional single/dual XMC/PMC sites CPU supported functions
- Two Gigabit LAN ports, PCIe port, four USB ports (2.0 or higher), one to three DVI-I port, three SATA ports, CFast port or similar (on-board)
- Audio in/out
- 1 or 2 RS232/RS485 port
- Eight GPIO
- System Temperature sensor (on-board)
- Two Fan control line (on-board)
- System Battery (on-board)
- Power monitoring LED (on-board) Form Factor
- One PMC/XMC – (125 mm x 165 mm)
- Two PMC/XMC – Mini ITX (200 mm x 165 mm) Power
- Input Power 10–32 VDC (on-board DC/DC, fused)
- Reset button Environment
- Temperature range: -40 °C to +85 °C (standard), -50 °C to +100 °C (extended)
COM module
- Intel® 4th Gen (Haswell) multi-core processor: Core™ i7 CPU for high performance or Core™ i5 CPU for low power
- Intel® 8-Series QM87 PCH chipset (formerly Lynx Point)
- Up to 16GB of high-speed DDR3L memory with SODIMM lock-down mechanism
- PEG/ General Purpose PCIe x16 (bifurcation/trifurcation supported)
- 7 ports of PCIe x1 (gangable into ports of greater width)
- SPI bus, LPC bus, SMBus (system)
- I2C (user)
- VGA Interface, 3x Digital Display Interface, eDP Interface (x2), HDA Audio Interface
- Gigabit Ethernet Media Dependent Interface (MDI)
- 4 USB 3.0/2.0 Ports, 4 USB 2.0 only Ports. 4 SATA III Ports (6 Gb/s), 4 General Purpose Outputs, 4 General Purpose Inputs, Post code display (Port 80)