Assembly Plant - Elma Trenew Electronic, Germany
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- Highest flexibility on small quantities and
quantity production runs
- Quantity targets: 25 to 25.000 pcs/a
- Maximum PCB size: 800x600 mm
- High quality: electrical, high voltage and optical test
- More than 500,000 backplanes
produced to date
- Express service
- Production in accordance with MIL standards
- Design and production of test software and
hardware for customized products
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In-Line Printer
- Two CCD-Cameras to control soldering paste printing and avoid shortcuts
- Stencil cleaner
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SMT Assembly
- Up to 10,000 components/hr
- Assembly precision: +/- .1mm for chip components, +/- .03mm for fine pitch
- PCB and component location by CCD camera
- Visual check: components, missing or bent connections, panel processing
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Vapor Phase Soldering
- Vapor phase pre-heating
- Infrared pre-heating
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Press Fit
- Press force: 81kN
- Cycle time: 3-5 sec
- Tool change type: revolver drum, change in 2-6 sec
- Supervision of press-in process, measuring force and distance with tolerance requirements
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Electrical Test
- Up to 21,620 test points (expandable to 300,000)
- Voltage to 250V
- Current to 50mA
- 1000 measurements/sec
- Isolation and continuity testing
- High voltage testing of up to 2000 VAC, 1500 VDC
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Optical Test
- CCD matrix camera verifying missing, displaced, twisted, or components with wrong polarity
- Height measurement
- Solder connection verification
- Short circuit control for IC pins
- Text verification
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Assembly Plant - Elma Bustronic, USA
The Elma Bustronic SMT line is over 40' long and includes an in-line printer, a pick-and-place SMT assembly machine, re-flow soldering system, and a multi-solvent backplane cleaning machine. Our customers benefit with faster turnaround times, increased volume and board complexity capabilities, and higher precision quality.
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SMT2220 In-Line Printer
The production line utilizes a SMT2220 In-Line printer for pick-and-place SMT assembly. With accurate printer alignment vision systems, the line facilitates high-speeds with the most precise component alignment. Alignment accuracy tolerance is to .0008" (1 pass), with 640H x 480V frame grabber resolution. |
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QuadIV Pick-and-Place Machine
The QuadIV pick-and-place machine grabs the components from the line feeders and places them on the solder pads. With accurate printer alignment vision systems, the line facilitates high-speeds with the most precise component alignment. Alignment accuracy tolerance is to .0008" (1 pass), with 640H x 480V frame grabber resolution. |
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Vitronics Soltec Thermal Processing System
The Vitronics Soltec XPM thermal processing system produces outstanding levels of uniformity and repeatability in solder re-flow. The heat convection is transferred through the body of the IC package and the PWB and directly into the solder joints. Their flux flow control system removes flux contaminants from each zone, resulting in clean heated tunnels, |
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AATC Multi-Solvent Cleaner
The AATC multi-solvent cleaner is designed to wash, rinse, and dry backplanes and PCBs. This machine speeds up the cleaning process and remove solder residue from backplanes in large volumes. |
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The Nu/Clean 318 Aqueous Cleaner
This Nu/Clean 318 Cleaner is the high-pressure DI-Water base cleaner. It has a pre-wash chamber with 32 high-pressure spray nozzles, the wash chamber has 64 high-pressure spray nozzles, the rinse chamber has 80 high-pressure spray nozzles and the final rinse chamber has 12 high-pressure spray nozzles.
It has one 10 HP high performance wash pump, one 10 HP high performance rinse pump, and three 15 HP high performance turbine air blowers for high efficiency drying of printed circuit boards.
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