Conduction Cooling
With an environmentally sealed enclosure or in high altitudes, there is often not enough airflow for convection cooling. Conduction cooled ATRs have a machined card cage that accomodates wedge locks to transfer the heat. Compliant to ARINC 404A specifications, the Elma conduction cooled ATR are optimized for cooling via thermal simulation studies. The typical temperature operating range is -40C to +70C degrees.
The conduction cooled ATR are optimized for low weight, ideal for Avionics applications where the load weight is a premium. Designed for 3U cards, the chassis has backplane options in cPCI, VME, or customized versions. Versions for 6U cards are also available. All Elma conduction cooled ATRs are assigned to meet the IEEE 1101.2 specification.
Optimal chassis features include a MIL 38999 type power connector with an integrated line filter. The power supply and line filter combination are optimized to meet MIL-STD 461E. The rugged aluminum dip-brazed construction is designed to meet MIL-STD 810F for shock and vibration. Elma also offers a line of standard convection-cooled ATRs that come in 1/2, 3/4, 1 and 1 1/2 ATR tall long formats per ARINC 404A specifications. Contact Elma for a specific solution tailored to your needs.
Liquid Cooling
Liquid cooling can meet some of the more extreme thermal challenges for chassis. Using liquid-flow-thru via the enclosure walls is a reliable and more cost effective form of cooling than many other liquid cooling avenues. One example is Elma's new liquid cooled ATR, developed from the company's field-proven air-cooled design that is already in service across numerous different fighting platforms.
The new liquid cooled enclosure allows an increased thermal capacity compared with the air cooled version. The side plate assembly consist of precision machined side walls, fluid carrying pipes, configured to avoid sharp bends, thermally conductive inserts and clamping brackets that can quickly be replaced as a complete sub-assembly in the field. The enclosure supports a thermal budget of up to 1500W per chassis, enabling the latest high performance boards to run well within their operating temperature envelope. A dual wall modular design significantly reduces MTTR; the cooling sidewalls are Line Replacement Units, so a swap out is a very simple process that can be carried out in the field. Each side plate has its own feed and return, so as they are independent of each other. Cooling is still provided in the event of damage to one side; the design also avoids running pipe work across the rear face of the chassis, the area most likely to be damaged if the unit is accidentally dropped.
Utilizing liquid-cooled design, Elma's new ATR provides a high degree of cooling capability for applications where other methods (forced air or conduction) are not adequate. This enables full advantage to be taken of the more powerful processors now available and facilitates effective cooling for the more extreme applications using new high-power architectures like VPX.
More Examples
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