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Signal Integrity
Backplane Signal Integrity Studies
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Simulation provides the expected performance of the backplane based on specific design criteria.
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Backplane characterization measures the real signal integrity of the backplane
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Ensures backplane will perform as expected before shipment
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Backplane characterization measures the real signal integrity of the backplane
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Simulation characteristics include impedance, cross-talk, propagation delay, attenuation, insertion & return loss and eye diagram
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Elma Bustronic Backplane Signal Integrity Initiative (SII)
With gigabit per second signal rates across the backplane, signal integrity analysis is increasingly important. In short, simulation and characterization of the backplane helps us ensure the performance results of a design. For simulation, it gives us a chance to foresee the expected results of a particular backplane design with the option of viewing the results in relation with the system's boards. This helps us perfect the design before going to fabrication. When performing backplane characterization, we can measure the real signal integrity of the backplane. This ensures the backplane perform as expected before being shipped to the customer.
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Elma Bustronic uses the following tools:
- HSPICE
- P-CAD signal integrity
- Iconnect
- HP 54750 TDR
- Specially designed probe cards
Examples of possible measurement characteristics:
- Impedance for single ended and differential lines
- Cross-Talk
- Propagation Delay
- S-parameter
- Eye Diagram
Examples of possible simulation characteristics:
- Impedance
- Cross-Talk
- Propagation Delay
- Attenuation
- Insertion & Return Loss
- Eye Diagram
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HSPICE modeling and simulation is the industry's preferred methodology for full system simulation. TDA's I-Connect allows the modeling engineer to combine differential s-parameter models with SPICE-based semiconductor and trace routing models in an overall SPICE-driven system simulation. The S-parameter models come from extracted empirical models captured by VNA and software driven TDT measurement techniques as well as the synthesized output of specialized 3D field solvers. The result is more accurately characterized via structures, much more capable connector models and a more precise representation of layout transition features and unavoidable stubs.
Measurement, model extraction, and simulation services Elma Bustronic offers services to characterize the interconnect path and provide models of representative circuit paths. These models can be used to generate reports that confirm the performance of these backplanes and also allow full system simulations to be performed that will help in the design process. Elma Bustronic can also provide the integration of measurement-derived models into the application engineering process. This includes the ability to easily generate eye-patterns based on the customer's specific requirements including such questions as signal degradation through backplane I/O connectors and specific lengths of I/O cabling.
Further, Elma Bustronic can provide measurement based models, purely synthesized models and simulation tools to provide design rules, suggest trace launch geometries and evaluate layer and laminate choices to the design engineers who are designing a new backplane.
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