Elma Electronic Americas English Products: Backplanes, VME, J1+J2 VME Monolithic Backplane, J1,J2,J3 Backplane, J2,J3 Development, J2 Rows A+C Overlay,VSB

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VME

J1+J2 VME Monolithic Backplane

All Elma Bustronic VME backplanes are designed to maximize performance, minimize noise, and to give the customer the most reliable, cost-effective product possible. To achieve this we use 8-layer construction, strip-line design, decoupling capacitors at every slot, inboard terminators, heavy power and ground planes, transient analysis simulation programs, and years of experience designing, building, and using backplanes. Three 2 oz. copper ground layers are used to fully shield the backplane to minimize R

Exceeds ANSI/VITA 1-1994 and IEEE P1014 specifications
2-21 slots
6U height
8-layer stripline design
Onboard, inboard termination
Outer grounds layers for mechanical protection
Optional BUSGRANT/IACK daisy chain connectors
Optimized via signal integrity studies
Accessories

Datasheet/Brochure

J1+J2 Monolithic VME Datasheet

More Info/Accessories

VME Reference Sheet

Product Configurator

	J1,J2,J3 Backplane The J1, J2, and J3 (J0) VME backplanes come in 3U heights and various slot sizes. The J2 versions can also have the A+C rows bussed.

	J2,J3 Development The J2 and J3 backplanes are ideal for prototyping. With all J2 pins undefined (except the B row) the J2 backplane allows flexibilty for testing and designing your system. The J3 development backplane has defined A+C rows as power, with B row remaining user-defined.

	J2 Rows A+C Overlay,VSB The Overlays come in three forms -- VSB, J2-rows A+C, and J3-row B. The J2 overlay module is used to upgrade an existing VMEbus J2 backplane to include the pinouts needed to implement signal bussing of the A and C rows of the connector. Modules can be plugged into the pin side of the host backplane. All row A and C pins are bussed.