Fremont, CA - September 11 , 2008
Elma Electronic Inc., a global manufacturer of electronic packaging products, has announced new ruggedized MicroTCA enclosures in a 19” rackmount format.
The new MicroTCA chassis features modified front panels that can be secured to the chassis. This provides more protection for shock and vibration. Shock absorbers/dampers can also be added to the enclosure for extra protection. Thermal management can be achieved via either convection or conduction-cooling.
As with Elma’s recently released ATR (Air Transport Rack) version of Ruggedized MicroTCA chassis, the 19” rackmount enclosures are designed to meet MIL-STD-810F, 167, 461D, and 901D. Standard ruggedization techniques can be utilized, including a shock isolated card cage and device mounting Rugged chassis shells are incorporated using thick aluminum sheets, extrusions, and die-castings.
The MicroTCA backplane used has 6 AMC, 1 MCH, 1 PM (to 600W) slots. Optimized via signal integrity studies, the backplane supports PCI-Express, Serial Rapid I/O and 10GBase-BX4 Switching. It has direct SATA / SAS connections and 3 synchronization clock networks. Other configurations are available.
Other chassis features include front-to-rear evacuative cooling, line filter, GND stud, shielded relay, IO panel, USB port, and fuse holder The removable fan tray has 1x (120mm x 120mm) fan and 2x (40mm x 40mm) fans, and a finger guard.
About Elma Electronic
Elma Electronic Inc. is a leading manufacturer and supplier of enclosures, backplanes, cabinets, cases, and "ready-to-run" packaging for CPCI, Rugged COTS, VME/64x, VXI, PC and custom bus structures. Elma's component product line offers a wide selection of top quality switches knobs and LED arrays. The company has been a worldwide supplier of dependable, high performance products for over 35 years. Elma operates three facilities in the continental United States plus has locations in Switzerland, Germany, France, the United Kingdom and Israel.
